What is Autoflow Lid Placement, Tack and Seam Sealing Systems?

Autoflow lid placement, tack, and seam sealing systems are technologies commonly used in the manufacturing and assembly processes of electronic components, particularly for hermetically sealed packages.

Autoflow lid placement refers to an automated process of precisely positioning the lid or cover onto a package or component. This is typically done in hermetic sealing applications where a lid needs to be accurately aligned and placed onto a base or housing to create an airtight seal. Autoflow lid placement systems use robotics, vision systems, or other advanced techniques to ensure precise lid positioning, minimizing the risk of misalignment or errors.

Tack sealing is a method used to temporarily bond the lid to the base or housing before the final sealing process. It involves applying a small amount of adhesive or sealant along the edges of the lid and pressing it onto the base. Tack sealing helps to hold the lid in place during subsequent processes, such as seam sealing or soldering, before achieving a permanent hermetic seal.

Seam sealing is the process of permanently joining the lid and base together to create a hermetically sealed package. The seam sealing system applies a continuous sealant or solder along the mating surfaces of the lid and base. This sealant or solder is then heated and cooled to create a durable and airtight bond. Seam sealing is commonly used in electronic packaging, where hermeticity is crucial for protecting sensitive components from moisture, gases, and other contaminants.

The combination of autoflow lid placement, tack sealing, and seam sealing systems allows for efficient and precise assembly of hermetically sealed packages in industries such as electronics, aerospace, and automotive. These technologies contribute to the reliability and longevity of electronic components by ensuring the integrity of the sealed enclosure, protecting the internal contents from environmental factors that could affect their performance.