Onto Innovation Rudolph Technologies F30™ System
Defect Inspection Machine
ONTO / RUDOLPH / AUGUST F30 Defect Inspection.
-Platform is specified for ISO5
-Filter wheel with color selection (RGB)
-1x, 3x, 5x, 10x , 20x review
-Has a OCR reader
-Dark field function implemented
-It can use the Discovery/True ADC software for offline review
-CD measurements are possible, but there is no separate optic available for this
-Bare wafers only. Must be modified if sawn wafers are on frame.
Manufacturer Catalogue Information about
Onto Innovation Rudolph Technologies F30™ System :
Designed to blur the lines between dark field micro inspection and traditional macro inspection, the F30 System provides automated defect inspection for front-end and outgoing quality (OQA) applications.
Product Overview
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
Applications
After develop inspection (ADI)
Fab Outgoing QA
Post CMP inspection
After etch inspection
Specifications
Throughput up to 120 wph (10µm)
Resolution flexibility (10µm to 0.5µm)
Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer
Teams with edge and backside modules for all-surface solution
Related Products & Markets
EB40 Module
Edge and backside inspection
Discover Defect Software
Inline yield and defect management
TrueADC Software
Automated defect classification software with a dynamic defect library
