CeraDrop x-Serie 3D inkjet Printed Electronics Unit – Year 2014

CeraDrop x-Serie 3D inkjet Printed Electronics Unit – Year 2014

Hardware Specifications

Motion System: High Accuracy Calibrated Five Axis Device
X and Y Stage Accuracy < +/- 1.5 µm
Z Accuracy < +/- 2 µm
X and Y Stage Repeatability < +/- 0.5 µm
Z Repeatability < +/- 1 µm
Print Velocity Up to 500 mm/s
Printheads Holder: Motorized and Plug & Play
Print Resolution < 5 µm x 5 µm
Printheads Number Up to 3 (mixed types)
Printhead Types Single nozzle
Low cost Dimatix Cartridges
Drive per nozzle printheads
Dimatix, Konica-Minolta and other on request (Xaar, Kyocera, Ricoh, Toshiba, Seiko, etc.)
Mounting “Smart door” technology – Accurate fast mount of printheads and its electronics
Ink Tank Cartridge 2 mL to 50 mL
Aggressive solvents compatible
Printhead Heating Up to 60°C
Printhead Maintenance Automatic cleaning station
Substrate Holder: Motorized Vacuum Heated Chuck
Size 305 mm x 305 mm
Clamping Vacuum with different areas
Heating Up to 60°C
Mechanical
Machine Footprint 1520 mm x 1290 mm x 1800 mm
Machine Mean Weight 1500 kg
Power 400 V / 32 A, 3 phases
Certification / Safety CE (UL & CSA on request)
Camera: Two Devices with Different Light Sources
Droplet Analysis
CCD 1392 x 1040 pixels
Visualization Area 1.31 x 1.64 mm
Image Analysis Fully automated (DropAnalyser)
Alignment and Printed Components Analysis
CCD 1624 x 1228 pixels
Visualization Area 1.79 x 1.35 mm
Alignment Types Marks, edge or specific if required
Image Analysis Fully automated (FabAnalyser)
Post-Treatment Area: To Dry and Cure Printed Layers
Post-Process Compatibility IR, UV, AdphosNIR®, Novacentrix PulseForge®, Xenon Sinteron, Vacuum Drying
Substrate Management Directly by the manufacturing linear axis to avoid substrate manipulation
Solvent Extraction Exhaust connection
Options
IR Drying Printhead slot
UV Laser reflectometer
AdphosNIR®, Novacentrix PulseForge®, Xenon Sinteron, Vacuum Drying HEPA filter
Other Post-Treatment Dedicated software add-on
Specific Hardware Modification Automated Handling (on request)
Automated sheet resistance measurement probe

Software Specifications

CeraSlice: Exclusive CAD/CAM Software
Approach Bottom-up approach to import, edit, to simulate and to sequence the printing of a wide range of printed electronics and smart 3D printing designs
File Formats DXF, STEP, Gerber, GDSII, BMP (as an option via conversion tool)
Job Editing Directly from standard CAD file via CAD/CAM tool
Printing Job Parameters Fully tunable for each part or under part of the components
Manufacturing Sequence Definition Easy and fast, for each step of the printing process (printing vector, nozzle clogging control, alignment, printhead cleaning etc.)
Advanced Simulation Stage Step by step, materials by materials
Experiment Plans Automated experiment plans generation to optimize inkjet process (fully customizable)
Customizable Pre-loaded Patterns Square transistors, circular transistors, multilayer capacitors, induction coil, etc.
DropAnalyser: Automated Drop Jetting Analysis Software
Waveform Tuning Real time, fully open, drive per nozzle
Automation Automatic printheads mapping
Analysis Volume, velocity, jet straightness error
Clogged nozzles detection
Self nozzles positions calibration
Drop to drop variation
Reporting Detailed statistics report on whole nozzle plate
FabAnalyser: Post-Printing Characterization Software
Layers Analysis Automated measurements (distance, area)
Automated full printing area acquisition
3D reconstruction via laser reflectometer option
Substrate Alignment Manual or automatic
Can be fully adapted to customer application

CeraDrop x-Serie Inkjet Printed Electronics System – Year 2014

Manufacturer CeraDrop
Model x-Serie
Year of Manufacture 2014
Purchase History Purchased by seller in 2016 for R&D purposes
Original Purchase Price USD 255,000
Condition Used – Overall in Excellent Condition
Usage Light usage only
Machine Type Turnkey Materials Deposition Inkjet System for Printed Electronics & Smart 3D Printing
Description
CeraPrinter X-Serie is a turnkey inkjet materials deposition system designed for advanced process development in printed electronics and smart 3D printing applications.
It features a patented rotative head-holder “plug and play” system, full curing area, in-situ characterization devices, and an exclusive software suite, making it a complete all-in-one solution for R&D and industrial innovation.
Technical Specifications
Maximum Substrate Size 305 x 305 mm (12.00 x 12.00 in)
Maximum Substrate Thickness 10 mm (0.39 in)
Motion System High accuracy 5-axis system
Alignment Accuracy ±2 µm
Nozzle Self Calibration < ±3 µm
Printheads Capacity Up to 3 printheads (more on request)
Ink Compatibility Aqueous, biologic, solvent-based and UV inks
Printing Modes Raster Scan Mode (X or Y)
Vector Mode (XY)
Single Pass (X or Y)
Shipping Information
Printer Weight Approx. 1497 kg (3,300 lbs)
Packaging Delivered in original crate
Computer & Monitor Shipped separately (approx. 7–9 kg / 15–20 lbs)
Sales Note
Available at a significant discount compared to original purchase price.
Ideal for R&D labs, universities, and advanced manufacturing environments.

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