A Resist Strip/Alkaline Etch Wet Processing System is a tool used in manufacturing semiconductors, specifically for cleaning silicon wafers. It involves a wet chemical process that removes unwanted material from the wafer surface. There are two main types of cleaning performed in this system:

• Resist Strip: This removes leftover photoresist, a light-sensitive material used to create patterns on the wafer during the microfabrication process.
• Alkaline Etch: This removes native oxide layers that can form on the silicon surface during processing. These oxides can hinder subsequent steps in chip fabrication.

The system typically uses tanks filled with chemical solutions, like:

• Solvent-based strippers: Often use mixtures including acetone or isopropyl alcohol (IPA) for resist removal.
• SPM (sulfuric acid-hydrogen peroxide) mixture: This is a common solution for both resist stripping and oxide etching.

The wet processing system controls factors like temperature and agitation to ensure a uniform and efficient cleaning process.

Here are some additional points to note:

• Modern systems may utilize ozone cleaning as an alternative to harsh chemicals for resist stripping. This offers environmental and safety benefits.
• The entire process is carefully controlled to avoid damaging the delicate silicon wafers.

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