Strasbaugh 7AF Wafer Grinder solution for semiconductor, data storage, SOI, LED, and a variety of R&D applications.
It delivers high volume throughput with superior finish and thickness control
This tool is also available through a lease-to-own option subject to credit approval

Manufacturer Catalogue Information about Strasbaugh 7AF Wafer Grinder:
Standard Features Include:
Touch Screen Controls, 19” Intuitive Interface
Dual grinding spindles, coarse and fine
Force adaptive grinding technology
Dual wafer spindles for optimal throughput
Four input/output cassette stations
Robotic load and unload with flipping end effector
In-situ thickness measurement gauges