Chroma 7936 Wafer Inspection System
Automatic Double Sided Post-Dicing Disc Chip Inspection System
This listing is for a Chroma 7936 Automated Double Sided Post Dicing Wafer Chip Inspection System. “The Chroma 7936 double-sided wafer inspection system is an automatic inspection system for wafer chips after dicing. It can perform double-sided LED top surface inspection at the same time. The appearance defects of the wafer chip are clearly conspicuous when using the advanced lighting technology.
Lighting and camera detection mode can be different for different wafer processes such as vertical chip, VCSEL, or flip chip Applied with a high-speed camera and inspection algorithms, the Chroma 7936 can inspect a 2” LED wafer with pad defects and mesa abnormalities in 4.5 minutes with a throughput of about 35 ms/chip inspect with pad debris and epi defects. The Chroma 7936 also provides – ITO peeling – chipping auto focus and warp compensation function – finger breakage – chip residue to solve wafer warpage and chuck leveling problems. It has two magnifications to choose from applicable chip size or defect size.
