Chemcut XLI-30 Resist Strip/Alkaline Etch Wet Processing System – Year 2022
SPECIFICATIONS:
3mil lines(76μ) and spaces with 1oz. copper
2 mil lines(51μ) and spaces with .5oz. copper
Temperature: 130° F (54° C)
Acid normality – 1N
Specific Gravity: 32 to 36 Be’ (1.28 to1.330)
Spray Pressure: 30 – 40 psi (2.0 to 2.7 bar)
Expected etch rate: approx. 1mils/min(25 μ /min)
Station 1 – Load (18 in. 457mm) o VentConnection
Station 2 – Etch (57 in. 1448mm)
38in.965mmEffective
SpecificGravityControlAutoBaume (set point ±0.5 Be to ± 0.006)
ChemicalDosing
ORPmonitor
Pumpout
1.5gpm(5.68lit./min)conenozzles o Upper/LowerPressureGauges
Station 3 – Isolation (12 in. 305mm) o Dragoutcontrol(Rollers) o FreshAirinlet
Station 4 –Rinse (43.3 in. 1100mm) o Three Stage Cascade
Flowmetertosump/fresh
Station 5 – Unload (18 in. 457mm)
System Total Length: 148.3in., 3767mm
Ultra-Thin conveyor Standard
75 ft. (22.8m) Wiring Harness
Adjustable Conveyor Speed Range: 14 -140 ipm
Product Thickness – 0.004(0.1mm)- 0.250(6.35mm) o Maximum Operating Temperature: 130°F, 54.4°C
Manufacturer Catalogue Information about Chemcut XLi :
At Chemcut, we offer three different product platforms for wet processing equipment.
We offer
the 2300 series,
the Chemcut XLi, and
the CC8000 model.
Each one has its strengths, but today we will discuss the XLi model. Here are some great qualities the Chemcut XLi equipment has to offer.
1. Customizable
Since the XLi model has a modular structure, you can customize your machine to perform any process you desire. With modular construction, adding or moving modules can be done easily.
2. Adaptable
Chemcut’s XLi is suitable for many tasks. Whichever your industry or company size, the XLi will be a good fit. Whether you need to use harsh chemistries, transport thin material, or operate reel-to-reel, the XLi can be designed to suit your needs.
3. Suitable for Large Production
In the XLi, you can get features that allow you to process more items in a smaller timeframe. With the XLi, you can get conveyor widths up to 60 inches allowing you to get more effective conveyor space, and you can get larger etch chambers so you can run your conveyor at a higher speed without any changes in things like etch depth or develop time.
